• DocumentCode
    1637298
  • Title

    High-breakdown voltage field-plated normally-off AlGaN/GaN HEMTs for power management

  • Author

    Huang, Wei ; Zhang, Shudan ; Xu, Juyan

  • Author_Institution
    58th Res. Inst., China Electron. Technol. Group Corp. (CETC), Wuxi, China
  • fYear
    2010
  • Firstpage
    1335
  • Lastpage
    1337
  • Abstract
    The high breakdown voltage AlGaN/GaN HEMTs with source-terminated field plate was firstly fabricated for high frequency and high power application, employing by CF4 plasma treatment for enhancement-mode (E-mode). The results showed that by adding the distance of gate to drain, LGD from 5 um to 15um, the breakdown voltage of the device was rapidly increased 350V, whose value is from 50V to 400V while the threshold voltage of the device, VTH was +0.5V by the charge modulation technology of CF4 plasma. When the distance of source-terminated field plate, LFP was about 3um, the breakdown voltage of the device was apparently improved because the electric field near the gate edge was effectively shielded. The breakdown voltage and the specific on-resistance for the LGD and LFP distance of the device about 15um and 3um were about 475V and about 2.9 m Ω · cm2 respectively. The results from RF measurement showed that with the variation of VGS, the fT and fMAX parameters of the device with source-terminated field plate were the order of Gigahertz frequency. The DC, AC and transient characteristics of E-mode Power AlGaN/GaN HEMTs were satisfied and its forward current was about 90 mA. Therefore the E-mode AlGaN/GaN HEMTs was very suitable as the novel power switch technology in energy management application.
  • Keywords
    III-V semiconductors; aluminium compounds; electric breakdown; electric resistance; gallium compounds; high electron mobility transistors; plasma materials processing; power electronics; AC characteristics; AlGaN-GaN; DC characteristics; RF measurement; charge modulation; electric field; energy management; enhancement-mode; field-plated normally-off HEMT; high frequency application; high power application; high-breakdown voltage; on-resistance; plasma treatment; power management; power switch technology; source-terminated field plate; transient characteristics; voltage 50 V to 400 V; Aluminum gallium nitride; Gallium nitride; HEMTs; Logic gates; MODFETs; Plasmas; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-5797-7
  • Type

    conf

  • DOI
    10.1109/ICSICT.2010.5667658
  • Filename
    5667658