DocumentCode
1637298
Title
High-breakdown voltage field-plated normally-off AlGaN/GaN HEMTs for power management
Author
Huang, Wei ; Zhang, Shudan ; Xu, Juyan
Author_Institution
58th Res. Inst., China Electron. Technol. Group Corp. (CETC), Wuxi, China
fYear
2010
Firstpage
1335
Lastpage
1337
Abstract
The high breakdown voltage AlGaN/GaN HEMTs with source-terminated field plate was firstly fabricated for high frequency and high power application, employing by CF4 plasma treatment for enhancement-mode (E-mode). The results showed that by adding the distance of gate to drain, LGD from 5 um to 15um, the breakdown voltage of the device was rapidly increased 350V, whose value is from 50V to 400V while the threshold voltage of the device, VTH was +0.5V by the charge modulation technology of CF4 plasma. When the distance of source-terminated field plate, LFP was about 3um, the breakdown voltage of the device was apparently improved because the electric field near the gate edge was effectively shielded. The breakdown voltage and the specific on-resistance for the LGD and LFP distance of the device about 15um and 3um were about 475V and about 2.9 m Ω · cm2 respectively. The results from RF measurement showed that with the variation of VGS, the fT and fMAX parameters of the device with source-terminated field plate were the order of Gigahertz frequency. The DC, AC and transient characteristics of E-mode Power AlGaN/GaN HEMTs were satisfied and its forward current was about 90 mA. Therefore the E-mode AlGaN/GaN HEMTs was very suitable as the novel power switch technology in energy management application.
Keywords
III-V semiconductors; aluminium compounds; electric breakdown; electric resistance; gallium compounds; high electron mobility transistors; plasma materials processing; power electronics; AC characteristics; AlGaN-GaN; DC characteristics; RF measurement; charge modulation; electric field; energy management; enhancement-mode; field-plated normally-off HEMT; high frequency application; high power application; high-breakdown voltage; on-resistance; plasma treatment; power management; power switch technology; source-terminated field plate; transient characteristics; voltage 50 V to 400 V; Aluminum gallium nitride; Gallium nitride; HEMTs; Logic gates; MODFETs; Plasmas; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-5797-7
Type
conf
DOI
10.1109/ICSICT.2010.5667658
Filename
5667658
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