DocumentCode
1639310
Title
Modeling and simulating for 3-D micro-manufacture process
Author
Liang, Xu-Dong ; Jian, Zhang
Author_Institution
Sch. of Electron. Sci. & Appl. Phys., Hefei Univ. of Technol., Hefei, China
fYear
2010
Firstpage
1865
Lastpage
1867
Abstract
A novel 3-D surface model for micro-manufacture process simulation is presented. This model uses unit vector of the parametric surface as an important parameter to achieve the surface evolution algorithm. According to various physical models of given fabrications, it can be applied to simulations of isotropic/anisotropic etching, deposition and other processes with surface evolution direction dependence. The simulation results of this model are 3-D visible of variable perspective. Some isotropic etching and isotropic deposition simulations are performed as examples and the results indicate the accurate simulated surface.
Keywords
etching; micromechanical devices; 3D micro-manufacture process modeling; 3D micro-manufacture process simulation; 3D surface model; anisotropic etching; isotropic deposition simulation; isotropic etching simulation; parametric surface; surface evolution algorithm; unit vector; Etching; Semiconductor device modeling; Simulation; Solid modeling; Surface topography; 3-D Simulation; Gauss integration; Micro-Manufacture; Model;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-5797-7
Type
conf
DOI
10.1109/ICSICT.2010.5667729
Filename
5667729
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