• DocumentCode
    1639310
  • Title

    Modeling and simulating for 3-D micro-manufacture process

  • Author

    Liang, Xu-Dong ; Jian, Zhang

  • Author_Institution
    Sch. of Electron. Sci. & Appl. Phys., Hefei Univ. of Technol., Hefei, China
  • fYear
    2010
  • Firstpage
    1865
  • Lastpage
    1867
  • Abstract
    A novel 3-D surface model for micro-manufacture process simulation is presented. This model uses unit vector of the parametric surface as an important parameter to achieve the surface evolution algorithm. According to various physical models of given fabrications, it can be applied to simulations of isotropic/anisotropic etching, deposition and other processes with surface evolution direction dependence. The simulation results of this model are 3-D visible of variable perspective. Some isotropic etching and isotropic deposition simulations are performed as examples and the results indicate the accurate simulated surface.
  • Keywords
    etching; micromechanical devices; 3D micro-manufacture process modeling; 3D micro-manufacture process simulation; 3D surface model; anisotropic etching; isotropic deposition simulation; isotropic etching simulation; parametric surface; surface evolution algorithm; unit vector; Etching; Semiconductor device modeling; Simulation; Solid modeling; Surface topography; 3-D Simulation; Gauss integration; Micro-Manufacture; Model;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-5797-7
  • Type

    conf

  • DOI
    10.1109/ICSICT.2010.5667729
  • Filename
    5667729