• DocumentCode
    1641520
  • Title

    Packaging and board assembly technology trend and impact on the supply chain

  • Author

    Shangguan, Dongkai

  • Author_Institution
    Flextronics, San Jose, CA, USA
  • fYear
    2004
  • Firstpage
    14
  • Lastpage
    17
  • Abstract
    The development and implementation of packaging and assembly technologies to enable continued miniaturization, functional densification and integration, as well as environmental friendliness, have specific and direct impact on the supply chain, including packaging, board assembly materials, processes and equipment. Fast time-to-market requirement, in combination with low cost and high reliability needs for different product categories, demands ever increasing cooperation throughout the supply chain, with early visibility.
  • Keywords
    packaging; printed circuit manufacture; supply chain management; board assembly technology; environmental friendliness; functional densification; functional integration; miniaturization; packaging technology; product categories; product packaging; supply chain; time-to-market requirement; Assembly; Costs; Electronics packaging; Logic testing; Packaging machines; Printers; Printing; Supply chains; Surface-mount technology; Time to market;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
  • Print_ISBN
    0-7803-8620-5
  • Type

    conf

  • DOI
    10.1109/HPD.2004.1346664
  • Filename
    1346664