DocumentCode
1641520
Title
Packaging and board assembly technology trend and impact on the supply chain
Author
Shangguan, Dongkai
Author_Institution
Flextronics, San Jose, CA, USA
fYear
2004
Firstpage
14
Lastpage
17
Abstract
The development and implementation of packaging and assembly technologies to enable continued miniaturization, functional densification and integration, as well as environmental friendliness, have specific and direct impact on the supply chain, including packaging, board assembly materials, processes and equipment. Fast time-to-market requirement, in combination with low cost and high reliability needs for different product categories, demands ever increasing cooperation throughout the supply chain, with early visibility.
Keywords
packaging; printed circuit manufacture; supply chain management; board assembly technology; environmental friendliness; functional densification; functional integration; miniaturization; packaging technology; product categories; product packaging; supply chain; time-to-market requirement; Assembly; Costs; Electronics packaging; Logic testing; Packaging machines; Printers; Printing; Supply chains; Surface-mount technology; Time to market;
fLanguage
English
Publisher
ieee
Conference_Titel
High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
Print_ISBN
0-7803-8620-5
Type
conf
DOI
10.1109/HPD.2004.1346664
Filename
1346664
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