• DocumentCode
    1641808
  • Title

    Predictive modeling of capacitance and resistance in gate-all-around cylindrical nanowire MOSFETs for parasitic design optimization

  • Author

    Xu, Qiumin ; Zou, Jibin ; Luo, Jieyin ; Wang, Runsheng ; Huang, Ru

  • Author_Institution
    Key Lab. of Microelectron. Devices & Circuits, Peking Univ., Beijing, China
  • fYear
    2010
  • Firstpage
    1958
  • Lastpage
    1960
  • Abstract
    This paper presents a predictive electrostatic capacitance and resistance compact model of multiple gate MOSFET with cylindrical conducting channels, taking into account parasitic effects, quantum confinement and quasi-ballistic effects. The model incorporates the dependence of channel length, gate height and width, gate-to-contact spacing, nanowire size, multiple channels, as well as 1-D ultra-narrow source/drain extension (SDE) doping profile. The proposed non-iterative electrostatic model is successfully verified, and can be used to predict nanowire-based circuit performance. Based on the analytical model, we can further examine which parasitic components are affecting the delay. Results revealed that Cside, Cof, Rsd, RQ are dominant factors and should be treated as a major design concern. Among all the parameters, Lsd, Tg and Ndop are essentially important in parasitic design optimization. By selectively modifying these parameters, parasitic effect is evidently reduced.
  • Keywords
    MOSFET; doping profiles; electrostatics; nanowires; optimisation; semiconductor device models; cylindrical conducting channels; cylindrical nanowire MOSFET; doping profile; multiple gate MOSFET; noniterative electrostatic model; parasitic design optimization; predictive electrostatic capacitance; predictive electrostatic resistance; quantum confinement; quasiballistic effects; source/drain extension; Analytical models; Delay; Logic gates; Quantum capacitance; Resistance; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-5797-7
  • Type

    conf

  • DOI
    10.1109/ICSICT.2010.5667822
  • Filename
    5667822