DocumentCode
1641996
Title
Study on the accelerated soakage testing during the reliability evaluation of plastic package
Author
Min, Qian ; Cuijun, Yang ; Hua, Yuan ; Yunpeng, Cao
Author_Institution
Microelectron. Dept., Suzhou Univ., Suzhou, China
fYear
2010
Firstpage
1964
Lastpage
1966
Abstract
In the semiconductor industry, during the component level reliability evaluation, the non-accelerated soakage testing in the precondition is normally proceeded, which takes much time. In order to reduce the soaking time, three accelerated soaking conditions are studied with reference to non-accelerated soaking condition (JEDEC Level 3 and JEITA Rank E). Under the three accelerated soaking conditions, the moisture gain and moisture distribution are studied and confirmed by FEA (Finite Element Analysis). Also, the failure is studied under the three accelerated conditions compared with those of non-accelerated soaking conditions. Thereby, the time to fail of the component is determined.
Keywords
finite element analysis; plastic packaging; semiconductor device reliability; semiconductor industry; FEA; JEDEC Level 3; JEITA Rank E; accelerated soakage testing; component level reliability evaluation; finite element analysis; moisture distribution; moisture gain; non-accelerated soakage testing; plastic package; semiconductor industry;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-5797-7
Type
conf
DOI
10.1109/ICSICT.2010.5667828
Filename
5667828
Link To Document