• DocumentCode
    1641996
  • Title

    Study on the accelerated soakage testing during the reliability evaluation of plastic package

  • Author

    Min, Qian ; Cuijun, Yang ; Hua, Yuan ; Yunpeng, Cao

  • Author_Institution
    Microelectron. Dept., Suzhou Univ., Suzhou, China
  • fYear
    2010
  • Firstpage
    1964
  • Lastpage
    1966
  • Abstract
    In the semiconductor industry, during the component level reliability evaluation, the non-accelerated soakage testing in the precondition is normally proceeded, which takes much time. In order to reduce the soaking time, three accelerated soaking conditions are studied with reference to non-accelerated soaking condition (JEDEC Level 3 and JEITA Rank E). Under the three accelerated soaking conditions, the moisture gain and moisture distribution are studied and confirmed by FEA (Finite Element Analysis). Also, the failure is studied under the three accelerated conditions compared with those of non-accelerated soaking conditions. Thereby, the time to fail of the component is determined.
  • Keywords
    finite element analysis; plastic packaging; semiconductor device reliability; semiconductor industry; FEA; JEDEC Level 3; JEITA Rank E; accelerated soakage testing; component level reliability evaluation; finite element analysis; moisture distribution; moisture gain; non-accelerated soakage testing; plastic package; semiconductor industry;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2010 10th IEEE International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-5797-7
  • Type

    conf

  • DOI
    10.1109/ICSICT.2010.5667828
  • Filename
    5667828