• DocumentCode
    1642832
  • Title

    Packaging accuracy examination of the polarization-maintaining dual fiber collimator basing on machine sight

  • Author

    Zhi, Wang ; Jianxin, Qiu

  • Author_Institution
    Changchun Inst. of Opt., Fine Mech. & Phys., Chinese Acad. of Sci., Changchun, China
  • fYear
    2004
  • Firstpage
    294
  • Lastpage
    296
  • Abstract
    The polarization extent of polarization-maintaining fiber depends on incident status of polarization light, to maintain polarization status of the polarization light, requiring the polarization status of the polarization light to coupling and accord with fast(low) axis direction of polarization fiber. Thus in polarization-maintaining dual fiber collimator, packaging accuracy of the dual pigtail affects polarization capability of the polarization-maintaining collimator directly. In this paper, researched and analyzed the effect that the packaging accuracy of the dual pigtail to polarization capability of the polarization-maintaining collimator, and indicated that cat eyes´ perpendicular degree of the dual pigtail was main factor. Based on machine sight, collected the end image of the dual pigtail by CCD camera, and established examine model of cat eyes´ perpendicular degree, achieved image processing and examined cat eyes´ perpendicular degree by VB program, examinable precision is 0.5 degree. This method was applied in industrial packaging.
  • Keywords
    collimators; image processing; light polarisation; packaging; CCD camera; VB program; cat eyes; dual fiber collimator; dual pigtail affects; end image; image processing; incident status; industrial packaging; machine sight; packaging accuracy examination; perpendicular degree; polarization capability; polarization light; polarization-maintaining fiber; Birefringence; Erbium; Lenses; Optical collimators; Optical coupling; Optical fiber polarization; Optical polarization; Optical refraction; Packaging machines; Physics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Density Microsystem Design and Packaging and Component Failure Analysis, 2004. HDP '04. Proceeding of the Sixth IEEE CPMT Conference on
  • Print_ISBN
    0-7803-8620-5
  • Type

    conf

  • DOI
    10.1109/HPD.2004.1346714
  • Filename
    1346714