DocumentCode
1645137
Title
AlGaN/GaN HEMT TCAD simulation and model extraction for RF applications
Author
Hartin, O. ; Green, Bruce
Author_Institution
Freescale, Tempe, AZ, USA
fYear
2010
Firstpage
232
Lastpage
236
Abstract
GaN devices have significant advantages in power density, thermal characteristics, and voltage range over those based on conventional compound semiconductors or Silicon. With GaN, as in other materials systems there are significant advantages in cycle time and strength of design from use of TCAD. Here TCAD simulations of AlGaN/GaN HEMTs are shown to accurately match measured DC and small signal AC data. For large signal RF applications it is necessary to use modeling to extend the application of this TCAD solution. Proprietary models are extracted from TCAD data and demonstrated.
Keywords
III-VI semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; technology CAD (electronics); AlGaN-GaN; HEMT TCAD simulation; RF application; compound semiconductor; materials system; model extraction; power density; silicon; thermal characteristics; Aluminum gallium nitride; Data models; Gallium nitride; Integrated circuit modeling; Load modeling; Logic gates; Radio frequency; AlGaN/GaN HEMT; RF circuits; RF devices; RF models; compound semiconductor modeling and simulation; device physics; power devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2010 IEEE
Conference_Location
Austin, TX
ISSN
1088-9299
Print_ISBN
978-1-4244-8578-9
Type
conf
DOI
10.1109/BIPOL.2010.5667949
Filename
5667949
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