A numerical analysis of thermal management schemes of a LED array in TFT TV

Author

Mermer, Omer ; Nil, Metin ; Akgul, M. Bahattin

Author_Institution

Dept. of Electr. & Electron. Eng., Ege Univ., Izmir, Turkey

fYear

2014

fDate

23-26 Oct. 2014

Firstpage

137

Lastpage

140

Abstract

This paper aims to perform the numerical analysis and to investigate thermal characteristics of the LED backlight TFT TV according to thermal design parameters. Natural convective cooling of a LED array system used TFT TV is considered in this study. Numerical computations are carried out for horizontal and vertical orientations of the LED array. The effects of the PCB materials on the temperature distribution are discussed in detail. It is found that the maximum temperature of the LED packages significantly decreases by the horizontal orientation of the LED array in TFT based television. In addition, ceramic based PCB materials having high thermal conductivity such as A1N present better thermal performance than that of metal based PCB materials.

Keywords

LED displays; ceramic packaging; cooling; natural convection; numerical analysis; printed circuits; television displays; temperature distribution; thermal conductivity; thermal engineering; thermal management (packaging); thin film transistors; LED backlight TFT TV array system; LED packaging; ceramic based PCB material; natural convective cooling; numerical analysis; printed circuit board; television; temperature distribution; thermal conductivity; thermal management scheme; Arrays; Electronic packaging thermal management; Light emitting diodes; Materials; Temperature distribution; Thermal analysis; Thin film transistors; LED; TFT TV; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Design and Technology in Electronic Packaging (SIITME), 2014 IEEE 20th International Symposium for

Conference_Location

Bucharest

Type

conf

DOI

10.1109/SIITME.2014.6967011

Filename

6967011