• DocumentCode
    164703
  • Title

    PSpice models of resistive transduscers used in building management

  • Author

    Pop, S. ; Bande, V. ; Pitica, D.

  • Author_Institution
    Appl. Electron. Dept., Tech. Univ. of Cluj Napoca, Cluj-Napoca, Romania
  • fYear
    2014
  • fDate
    23-26 Oct. 2014
  • Firstpage
    163
  • Lastpage
    166
  • Abstract
    This paper is related to PSpice modelling of resistive transducers used in dam´s management. In the hydro-energetic buildings, but especially in dam´s monitoring, the resistive transducers used for building management have a complex structure. These transducers have one or two physical parameters that affect their behavior. First of all, the temperature is the most common parameter, but, for example, for the strain transducer, there is also the force or the pressure. The PSpice model revealed in this paper applies the concept of the voltage controlled resistors (VCR) [1]. Basically, the temperature transducer is defined as a variable resistor with four terminals, where the resistance value between the two supplementary terminals is controlled by a voltage applied between them. In addition, the model of the strain transducer has two of the above control voltages and also two resistive elements. The mathematical relationship between the control voltage and the output resistance is based on the transducer´s electrical characteristic. Here, from the transducer´s point of view, the voltages have a physical meaning. The proposed models may be used in DC measurement circuits, in differential or ground referenced circuit topology.
  • Keywords
    building management systems; network topology; reference circuits; resistors; temperature sensors; transducers; DC measurement circuits; PSpice modelling; building management; differential referenced circuit topology; ground referenced circuit topology; resistive transducers; strain transducer; temperature transducer; voltage controlled resistors; Integrated circuit modeling; Mathematical model; Resistance; SPICE; Strain; Temperature measurement; Transducers; PSpice model; resistive transducer; strain; temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology in Electronic Packaging (SIITME), 2014 IEEE 20th International Symposium for
  • Conference_Location
    Bucharest
  • Type

    conf

  • DOI
    10.1109/SIITME.2014.6967018
  • Filename
    6967018