DocumentCode
164703
Title
PSpice models of resistive transduscers used in building management
Author
Pop, S. ; Bande, V. ; Pitica, D.
Author_Institution
Appl. Electron. Dept., Tech. Univ. of Cluj Napoca, Cluj-Napoca, Romania
fYear
2014
fDate
23-26 Oct. 2014
Firstpage
163
Lastpage
166
Abstract
This paper is related to PSpice modelling of resistive transducers used in dam´s management. In the hydro-energetic buildings, but especially in dam´s monitoring, the resistive transducers used for building management have a complex structure. These transducers have one or two physical parameters that affect their behavior. First of all, the temperature is the most common parameter, but, for example, for the strain transducer, there is also the force or the pressure. The PSpice model revealed in this paper applies the concept of the voltage controlled resistors (VCR) [1]. Basically, the temperature transducer is defined as a variable resistor with four terminals, where the resistance value between the two supplementary terminals is controlled by a voltage applied between them. In addition, the model of the strain transducer has two of the above control voltages and also two resistive elements. The mathematical relationship between the control voltage and the output resistance is based on the transducer´s electrical characteristic. Here, from the transducer´s point of view, the voltages have a physical meaning. The proposed models may be used in DC measurement circuits, in differential or ground referenced circuit topology.
Keywords
building management systems; network topology; reference circuits; resistors; temperature sensors; transducers; DC measurement circuits; PSpice modelling; building management; differential referenced circuit topology; ground referenced circuit topology; resistive transducers; strain transducer; temperature transducer; voltage controlled resistors; Integrated circuit modeling; Mathematical model; Resistance; SPICE; Strain; Temperature measurement; Transducers; PSpice model; resistive transducer; strain; temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology in Electronic Packaging (SIITME), 2014 IEEE 20th International Symposium for
Conference_Location
Bucharest
Type
conf
DOI
10.1109/SIITME.2014.6967018
Filename
6967018
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