DocumentCode
1647061
Title
A 100-GHz distributed amplifier in chip-size package
Author
Masuda, S. ; Kobayashi, K. ; Kira, H. ; Kitajima, M. ; Takesue, M. ; Kamiya, Y. ; Joshin, K.
Author_Institution
Fujitsu Labs. Ltd., Atsugi, Japan
Volume
2
fYear
2003
Firstpage
1029
Abstract
We developed a new millimeter-wave plastic chip size package (CSP) to operate up to 100 GHz by using a thin-film substrate. It has a flip-chip distributed amplifier with inverted microstrip lines that has a bandwidth of beyond 110 GHz. The CSP amplifier achieved a gain of 7.8 dB and a 3 dB bandwidth of 97 GHz, and operated up to 100 GHz as an amplifier. To our knowledge, this value is the highest operating frequency reported to date for a distributed amplifier sealed in a plastic CSP.
Keywords
MIMIC; MMIC amplifiers; chip scale packaging; distributed amplifiers; flip-chip devices; millimetre wave amplifiers; wideband amplifiers; 100 GHz; 110 GHz; 7.8 dB; 97 GHz; EHF; MM-wave chip scale package; flip-chip distributed amplifier; inverted microstrip lines; millimeter-wave CSP; plastic CSP; thin-film substrate; Assembly; Bandwidth; Chip scale packaging; Distributed amplifiers; MMICs; Millimeter wave technology; Millimeter wave transistors; Plastics; Resins; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2003 IEEE MTT-S International
Conference_Location
Philadelphia, PA, USA
ISSN
0149-645X
Print_ISBN
0-7803-7695-1
Type
conf
DOI
10.1109/MWSYM.2003.1212544
Filename
1212544
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