DocumentCode
1654608
Title
Voltage propagation method for 3-D power grid analysis
Author
Zhang, Cheng ; Pavlidis, Vasilis F. ; De Micheli, Giovanni
Author_Institution
Integrated Syst. Lab., EPFL, Lausanne, Switzerland
fYear
2012
Firstpage
844
Lastpage
847
Abstract
Power grid analysis is a challenging problem for modern integrated circuits. For 3-D systems fabricated using stacked tiers with TSVs, traditional power grid analysis methods for planar (2-D) circuits do not demonstrate the same performance. An efficient IR drop analysis method for 3-D large-scale circuits, called 3-D voltage propagation method, is proposed in this paper. This method is compared with another widely used power grid analysis method, with preconditioned conjugated gradients. Simulation results demonstrate that the proposed method is more efficient for the IR drop analysis of large size 3-D power grids. Speedups between 10× to 20× over the preconditioned conjugated gradients method are shown.
Keywords
three-dimensional integrated circuits; 2D circuits; 3D large-scale circuits; 3D power grid analysis method; 3D voltage propagation method; IR drop analysis; IR drop analysis method; planar circuits; preconditioned conjugated gradients; Algorithm design and analysis; Benchmark testing; Convergence; Integrated circuit modeling; Power grids; Resistance; Through-silicon vias; 3-D integrated circuits; Power grid analysis; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2012
Conference_Location
Dresden
ISSN
1530-1591
Print_ISBN
978-1-4577-2145-8
Type
conf
DOI
10.1109/DATE.2012.6176613
Filename
6176613
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