• DocumentCode
    1658754
  • Title

    A physical-based analytical turn-on model of polysilicon thin film transistors for circuit simulation

  • Author

    Yang, Gi-Young ; Hur, Sung-Hoi ; Kim, Choong-ki ; Han, Chul-Hi

  • Author_Institution
    Center for Electro-Optics, Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
  • fYear
    1995
  • Firstpage
    953
  • Lastpage
    956
  • Abstract
    A physical-based analytical current model of poly-Si TFTs for circuit simulation is presented. The model includes the barrier potential at grain boundaries, drain induced grain barrier lowering (DIGBL), temperature dependence, and the kink effect. The basic equation in the model has an algebraic form for implementation in circuit simulators. The model has the advantages of: simple relations between the model parameters and the device or material parameters; and ease of implementation in circuit simulators. In addition to the current model, a capacitance model based on the current model is presented. Comparisons between the model and measured results show excellent agreements in the wide range of operating voltages and for devices with different dimensions
  • Keywords
    MOSFET; capacitance; circuit analysis computing; elemental semiconductors; grain boundaries; semiconductor device models; silicon; thin film transistors; Si; analytical turn-on model; barrier potential; capacitance model; circuit simulation; current model; drain induced grain barrier lowering; grain boundaries; kink effect; physical-based model; poly-Si TFT; polysilicon TFT; temperature dependence; thin film transistors; Analytical models; Capacitance; Circuit simulation; Current density; Equations; Grain boundaries; Impact ionization; Temperature dependence; Thin film transistors; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1995. IEDM '95., International
  • Conference_Location
    Washington, DC
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-2700-4
  • Type

    conf

  • DOI
    10.1109/IEDM.1995.499374
  • Filename
    499374