Low-cost surface mount packaging for SAWs

Author

Gore, J. ; Horine, Bryce ; Phillips, J. ; Hoffman, R. ; Dodge, J.

Author_Institution

Sawtek Inc., Orlando, FL, USA

fYear

1992

Firstpage

129

Abstract

The special challenges of surface mount technology as they apply to the surface acoustic wave (SAW) manufacturer are reviewed. Some possible solutions are offered. The effects of each of the problem areas on the choice of package technology are considered. The technology options include ceramic bases (solder, epoxy, resistance welded, or glass frit sealed), plastic (epoxy sealed), and quartz (glass frit sealed). Emphasis is placed on ceramic bases as they seem to best fulfill the requirements of the commercial marketplace at this time. The tradeoffs of each sealing technique are discussed. The issue of thermal mismatch is addressed for leadless packages, with some suggestions on how to manage it. Some ideas on test fixturing are given

Keywords

ceramics; soldering; surface acoustic wave devices; surface acoustic wave filters; surface mount technology; SAW; SAW filters; SAWs; SMT; ceramic bases; epoxy sealing; glass frit sealing; leadless packages; low cost; package technology; plastic; quartz; resistance welding; solder sealing; surface acoustic wave; surface mount packaging; surface mount technology; test fixturing; thermal mismatch; tradeoffs; Acoustic waves; Ceramics; Glass; Manufacturing; Packaging; Sawing machines; Surface acoustic waves; Surface resistance; Surface-mount technology; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 1992. Proceedings., IEEE 1992

Conference_Location

Tucson, AZ

Print_ISBN

0-7803-0562-0

Type

conf

DOI

10.1109/ULTSYM.1992.276052

Filename

276052