• DocumentCode
    1661991
  • Title

    An Estimate of the Transaction of Environmental Impacts as a Result of Switching to Pb-free Solder

  • Author

    Itsubo, Norihiro ; Kubo, Toshiaki ; Noh, Jaesung ; Inaba, Atsushi

  • Author_Institution
    Musashi Inst. of Technol., Tokyo
  • fYear
    2005
  • Firstpage
    559
  • Lastpage
    560
  • Abstract
    Toxic properties of lead has led to strong demands by the public for the development of Pb-free products. Since the lead in solder used in electrical products risks being emitted into the environment if not properly collected at the end of its life cycle, switching conventional solders to Pb-free versions is regarded as especially important. Life Cycle Assessment (LCA), a quantitative assessment method for evaluating environmental burdens and impacts of product systems over their entire life cycles, is expected to be used as an accurate assessment tool for Pb-free solders. In the current survey, mid-term prediction of the social effect as a result of switching to Pb-free solder is assessed and examined. The effects on the whole of society were assessed by making an analysis of the time series and using the Population Balance Model (PBM). The effects are expressed as reduced external costs by using a method of life cycle impact assessment
  • Keywords
    electrical products; environmental factors; product life cycle management; socio-economic effects; solders; time series; toxicology; Pb-free solder; electrical products; environmental burdens; environmental impacts; life cycle assessment; population balance model; product systems; quantitative assessment method; social effects; time series; toxic property; Computer displays; Databases; Electrical products; Electrical products industry; Environmentally friendly manufacturing techniques; Lead; Production; Recycling; Switches; Time series analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Environmentally Conscious Design and Inverse Manufacturing, 2005. Eco Design 2005. Fourth International Symposium on
  • Conference_Location
    Tokyo
  • Print_ISBN
    1-4244-0081-3
  • Type

    conf

  • DOI
    10.1109/ECODIM.2005.1619294
  • Filename
    1619294