• DocumentCode
    1663909
  • Title

    Dynamic address compression schemes: a performance, energy, and cost study

  • Author

    Liu, Jiangjiang ; Sundaresan, Krishnan ; Mahapatra, Nihar R.

  • Author_Institution
    Dept. of Comp. Sci & Eng., State Univ. of New York, Buffalo, NY, USA
  • fYear
    2004
  • Firstpage
    458
  • Lastpage
    463
  • Abstract
    Dynamic address compression schemes that exploit address locality can help reduce both address bus energy and cost simultaneously with only a small performance penalty. In this work, we investigate two such schemes and determine their optimal parameters that result in the highest area/cost reductions and least performance penalty for various address buses (both on- and off-chip) in current systems. For addresses compressed with these schemes, we study energy reduction of buses in current and future nanometer technology nodes. Our study uses the cycle-accurate simulator for the Alpha 21264 processor called sim-alpha for performance estimation and accurate interconnect models considering inter-wire capacitances for bus energy estimation. Results show that using address compression results in only small performance overheads (less than 1% for compressing a 38-bit bus to 14 bits) and reduce bus energy dissipation by as much as 13% when applied to on-chip buses in current technologies.
  • Keywords
    cache storage; cost reduction; microprocessor chips; system-on-chip; Alpha 21264 processor; bus energy dissipation reduction; bus energy estimation; cost reduction; cycle accurate simulator; dynamic address compression; interwire capacitances; nanometer technology; off-chip buses; on-chip buses; sim-alpha; Capacitance; Cost function; Data buses; Delay; Encoding; Energy consumption; Energy dissipation; Logic; System-on-a-chip; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design: VLSI in Computers and Processors, 2004. ICCD 2004. Proceedings. IEEE International Conference on
  • ISSN
    1063-6404
  • Print_ISBN
    0-7695-2231-9
  • Type

    conf

  • DOI
    10.1109/ICCD.2004.1347962
  • Filename
    1347962