DocumentCode
1664539
Title
Characterization of chlorine discharge and etch selectivity in a magnetically confined ICP tool
Author
Sarfaty, M. ; Harper, M. ; Baum, C. ; Hershkowitz, N. ; Shohet, J.L.
Author_Institution
ERC for Plasma-Aided Manuf., Wisconsin Univ., Madison, WI, USA
fYear
1998
Firstpage
306
Abstract
Summary form only given, as follows. Plasma uniformity of both charged and neutral particles is characterized by a novel electro-optical probe, that combines a double sided Langmuir probe (Mach probe) and an optical fiber. Spatial distribution of plasma potentials and density, electron energy distribution function, and ion velocities are determined by the Mach probe. The spatially and spectrally resolved optical emission is collected by a collimated optical fiber with a restricted line-of-sight. The spatial distribution of atomic chlorine and the fractional dissociation of chlorine molecule are obtained by actinometry. Real-time etch rate selectivity of unpatterned polysilicon and SiO/sub 2/ thin films is determined within seconds by an in-situ two-color laser interferometer. Single and double point schemes of reflected laser interferometry are used to determine the etch selectivity as a function of tool state parameters. The changes in atomic chlorine density during the time varying process is obtained by xenon and argon actinometry and on-line mass spectrometry measured by a pressure calibrated residual gas analyzer. The difference in etch selectivity of polysilicon to SiO/sub 2/ between simultaneous and separate etch of the two films will be discussed.
Keywords
Langmuir probes; chlorine; discharges (electric); plasma confinement; plasma density; plasma diagnostics; sputter etching; Cl/sub 2/; Cl/sub 2/ discharge; Mach probe; SiO/sub 2/; actinometry; charged particles; double sided Langmuir probe; electro-optical probe; electron energy distribution function; etch selectivity; fractional dissociation; in-situ two-color laser interferometer; ion velocity; magnetically confined ICP tool; neutral particles; optical emission; optical fiber; plasma density; plasma potentials; plasma uniformity; pressure calibrated residual gas analyzer; real-time etch rate selectivity; reflected laser interferometry; restricted line-of-sight; spatial distribution; tool state parameters; Atomic beams; Atomic measurements; Distribution functions; Electrons; Etching; Optical fibers; Optical interferometry; Plasma applications; Plasma density; Probes;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science, 1998. 25th Anniversary. IEEE Conference Record - Abstracts. 1998 IEEE International on
Conference_Location
Raleigh, NC, USA
ISSN
0730-9244
Print_ISBN
0-7803-4792-7
Type
conf
DOI
10.1109/PLASMA.1998.677918
Filename
677918
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