• DocumentCode
    1667376
  • Title

    The influences of rapid-thermal annealing on the characteristics of Sr0.6Ba0.4Nb206 thin film

  • Author

    Yang, Cheng-Fu ; Diao, Chien-Chen ; Wu, Chia-Ching ; Leu, Ching-Chich

  • Author_Institution
    Dept. of Chem. & Mater. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan
  • fYear
    2010
  • Firstpage
    1274
  • Lastpage
    1275
  • Abstract
    Strontium barium niobate, Sr0.6Ba0.4Nb2O6 (SBN) ceramic is used as the targets to deposit the SBN thin films. By careful control of sputtering parameters, the optimal sputtering parameters for depositing SBN thin films are the substrate temperature of 500°C, chamber pressure of 10 mTorr, RF power of 120W, and oxygen concentration of 40%. The rapid-thermal annealing (RTA) process is used to anneal the SBN thin films at different temperatures and their physical and electrical characteristics are investigated. The influences of RTA-treated temperatures on the crystalline characteristics, micrographs, leakage current density-electrical field (J-E) curves, and capacitance-voltage (C-V) curves are developed.
  • Keywords
    barium compounds; ferroelectric ceramics; ferroelectric thin films; leakage currents; niobium compounds; rapid thermal annealing; strontium compounds; RTA-treated temperatures; SBN ceramic; SBN thin films; Sr0.6Ba0.4Nb2O6; capacitance-voltage curves; crystalline characteristics; electrical characteristics; leakage current density-electrical field curves; micrographs; physical characteristics; power 120 W; pressure 10 mtorr; rapid-thermal annealing; sputtering parameters; strontium barium niobate; temperature 500 C; Annealing; Barium; Capacitance-voltage characteristics; Ceramics; Niobium compounds; Optimal control; Pressure control; Sputtering; Strontium; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference (INEC), 2010 3rd International
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-3543-2
  • Electronic_ISBN
    978-1-4244-3544-9
  • Type

    conf

  • DOI
    10.1109/INEC.2010.5424912
  • Filename
    5424912