DocumentCode
1667663
Title
Effects of applied voltage on barrier oxide layer in porous AAO fabrication
Author
Kim, Ji-Hong ; Jang, Sung Uk ; Park, Ki Hoon ; Kwon, Soon-Ju
Author_Institution
Dept. of Mater. Sci. & Eng., Pohang Univ. of Sci. & Technol., Pohang, South Korea
fYear
2010
Firstpage
499
Lastpage
500
Abstract
Anodic aluminum oxide (AAO) with self-aligned nano-pores has fascinated researchers because of its potential application as an excellent template for nanotechnology. However the process to obtain long-range ordered pore structure is somewhat complicated, which hinders the full utilization of AAO. To make well-aligned porous AAO by hard anodizing (HA, ¿100V), one has to study more closely the controlling parameters of the barrier oxide layer thickness. On the basis of experimental results, a model for relation between external voltage and barrier layer thickness is suggested. The model has been derived through 3 steps. (1)The oxide growth rate is acquired from the oxidation current density combined with the `high field conduction´ model and the Faraday´s law. (2)Equation for dissolution rate of oxide is calculated from the Joule heating effect and heat of formation of Al2O3. (3)The relation between the barrier layer thickness and the voltage at the steady state is obtained by equating the growth and the dissolution rate of porous anodic oxide film. Finally, experimental results are fitted to the model and interpretation of various parameters in the model is given.
Keywords
alumina; anodisation; current density; dissolving; long-range order; nanofabrication; nanoporous materials; oxidation; porosity; Al; Al2O3; Joule heating effect; barrier oxide layer thickness; current density; dissolution rate; external voltage; hard anodization; heat of formation; high field conduction model; long-range ordered pore structure; oxidation; porous anodic oxide film; self-aligned nanopores; Fabrication; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-3543-2
Electronic_ISBN
978-1-4244-3544-9
Type
conf
DOI
10.1109/INEC.2010.5424925
Filename
5424925
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