Interconnections/micro-networks for integrated microelectronics

Author

Tewksbury, S.K. ; Uppuluri, M. ; Hornak, L.A.

Author_Institution

Dept. of Electr. & Comput. Eng., West Virgina Univ., Morgantown, WV, USA

fYear

1992

Firstpage

180

Abstract

An overview of interconnections within microelectronic systems is provided from the viewpoint of a communications-oriented audience, drawing on the expected evolution to ULSI systems. General issues and opportunities arising in the area of interconnections and packaging are discussed, along with some important characteristics suggesting the need for new communication network architectures and protocols for micronetworks. Several of the technology issues are reviewed, with particular emphasis on advanced packaging evolving for present VLSI systems. Performance models for the communications channels provided by microelectronic interconnections are summarized. High-speed communications within a microelectronic system are considered

Keywords

VLSI; integrated circuit technology; multichip modules; MCM; ULSI systems; VLSI systems; communications channels; high-speed communications; integrated microelectronics; interconnections; micronetworks; packaging; Computer networks; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit packaging; Integrated circuit technology; Local area networks; Microelectronics; Thin film circuits; Ultra large scale integration; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Global Telecommunications Conference, 1992. Conference Record., GLOBECOM '92. Communication for Global Users., IEEE

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0608-2

Type

conf

DOI

10.1109/GLOCOM.1992.276496

Filename

276496