• DocumentCode
    1668988
  • Title

    Partial trench isolated body-tied (PTIBT) structure for SOI applications

  • Author

    Min, B.W. ; Dakshina-Murthy, S. ; Mendicino, M.

  • Author_Institution
    Digital DNA Labs., Motorola, Austin, TX, USA
  • fYear
    2001
  • Firstpage
    71
  • Lastpage
    72
  • Abstract
    Silicon on insulator (SOI) technology has gained interest to provide improvements in speed and power consumption over bulk technologies. However, floating body effects of SOI devices such as kinks, parasitic bipolar action and hysteretic propagation delay have retarded its application. To eliminate these undesirable effects several body-tied structures have been suggested, but all generally suffer from adverse costs such as performance degradation and/or process complexity. We propose a novel body-tied structure, adding simple partial trench isolation, which effectively suppresses the floating body effects without performance degradation.
  • Keywords
    MOSFET; scanning electron microscopy; semiconductor device measurement; silicon-on-insulator; PTIBT; SOI applications; floating body effect suppression; floating body effects; hysteretic propagation delay; kinks; parasitic bipolar action; partial trench isolated body-tied structure; silicon on insulator; CMOS process; CMOS technology; Capacitance; DNA; Degradation; Energy consumption; Etching; Isolation technology; Laboratories; Silicon on insulator technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 2001 IEEE International
  • Conference_Location
    Durango, CO, USA
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-6739-1
  • Type

    conf

  • DOI
    10.1109/SOIC.2001.957990
  • Filename
    957990