DocumentCode
1669690
Title
Magnetostrictive properties of amorphous TbFe/FeB multilayer thin films by DC magnetron sputtering
Author
Wang, Wei ; Mi, Yiming ; Qian, Shiqiang ; Zhou, Xiying
Author_Institution
Sch. of Mater. Eng., Shanghai Univ. of Eng. Sci., Shanghai, China
fYear
2010
Firstpage
1124
Lastpage
1125
Abstract
Magnetostrictive multilayer films which consists of amorphous TbFe and FeB were prepared by dc magnetron sputtering onto glass substrates. The structure, magnetic and magnetostrictive properties of TbFe/FeB multilayer thin films were investigated at different annealing temperatures. The results reveal that the soft magnetic and magnetostrictive properties for TbFe/FeB multilayer thin films compared to TbFe single layer thin films were obviously improved. In comparison to the intrinsic coercivity JHc of 59.2 kA/m for TbFe single layer thin films, the intrinsic coercivity JHc for TbFe/FeB multilayer thin films rapidly drops to 27.3 kA/m. After annealing at 350°C for 60 min, the maximum saturation magnetostrictive coefficient of ¿s = 410 à 10-6 was obtained. The best low-field magnetostrictive coefficient could reach to 177 à 10-6 under 40 kA/m external magnetic field for the TbFe/FeB multilayer thin films after annealing at 250°C for 60 min.
Keywords
amorphous magnetic materials; annealing; boron alloys; coercive force; iron alloys; magnetic multilayers; magnetic thin films; magnetostriction; soft magnetic materials; sputtered coatings; terbium alloys; DC magnetron sputtering; TbFe-FeB; amorphous multilayer thin films; annealing temperatures; glass substrates; intrinsic coercivity; low-field magnetostrictive coefficient; saturation magnetostrictive coefficient; soft magnetic property; temperature 250 degC; temperature 350 degC; time 60 min; Amorphous magnetic materials; Amorphous materials; Annealing; Magnetic films; Magnetic multilayers; Magnetic properties; Magnetostriction; Saturation magnetization; Soft magnetic materials; Sputtering;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-3543-2
Electronic_ISBN
978-1-4244-3544-9
Type
conf
DOI
10.1109/INEC.2010.5425002
Filename
5425002
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