• DocumentCode
    1674006
  • Title

    Silicon-on-silicon multichip modules: technology and applications

  • Author

    Dai, Wayne Wei-Ming

  • Author_Institution
    California Univ., Santa Cruz, CA, USA
  • fYear
    1995
  • Firstpage
    307
  • Lastpage
    311
  • Abstract
    The long awaited Multi-Chip Module (MCM) market has finally arrived. This paper presents the state-of-the-art of the silicon-on-silicon MCM technology and describes some typical MCM products for both high performance digital applications and low cost mixed signal applications. By low cost silicon-on-silicon MCMs, we mean a few chip MCMs on a small silicon substrate which can be packaged into a standard IC package. Low cost silicon-on-silicon MCMs will continue to pave the way for accelerating the commercial availability and utilization of the technology
  • Keywords
    digital integrated circuits; elemental semiconductors; integrated circuit packaging; mixed analogue-digital integrated circuits; multichip modules; silicon; Si; commercial availability; digital applications; mixed signal applications; multichip modules; standard IC package; Acceleration; Costs; Integrated circuit packaging; Manufacturing; Military computing; Multichip modules; Production; Silicon; Telephony; Workstations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology, 1995 4th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    0-7803-3062-5
  • Type

    conf

  • DOI
    10.1109/ICSICT.1995.500150
  • Filename
    500150