DocumentCode
1674006
Title
Silicon-on-silicon multichip modules: technology and applications
Author
Dai, Wayne Wei-Ming
Author_Institution
California Univ., Santa Cruz, CA, USA
fYear
1995
Firstpage
307
Lastpage
311
Abstract
The long awaited Multi-Chip Module (MCM) market has finally arrived. This paper presents the state-of-the-art of the silicon-on-silicon MCM technology and describes some typical MCM products for both high performance digital applications and low cost mixed signal applications. By low cost silicon-on-silicon MCMs, we mean a few chip MCMs on a small silicon substrate which can be packaged into a standard IC package. Low cost silicon-on-silicon MCMs will continue to pave the way for accelerating the commercial availability and utilization of the technology
Keywords
digital integrated circuits; elemental semiconductors; integrated circuit packaging; mixed analogue-digital integrated circuits; multichip modules; silicon; Si; commercial availability; digital applications; mixed signal applications; multichip modules; standard IC package; Acceleration; Costs; Integrated circuit packaging; Manufacturing; Military computing; Multichip modules; Production; Silicon; Telephony; Workstations;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1995 4th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-3062-5
Type
conf
DOI
10.1109/ICSICT.1995.500150
Filename
500150
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