DocumentCode
167930
Title
Methods for planar integrated low pass filter performance improvements in high frequency
Author
Racasan, A. ; Munteanu, C. ; Topa, V. ; Pacurar, C. ; Hebedean, C. ; Cislariu, M.
Author_Institution
Dept. of Electrotechnics & Meas., Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania
fYear
2014
fDate
16-18 Oct. 2014
Firstpage
617
Lastpage
621
Abstract
The improvement of the performances of a filter involves two major research directions: the first one refers to the attenuation increase (through the increase of the losses) at high frequency and the second one refers to the suppression of the parasitic effects from the constitutive devices. In this light, this paper presents the authors contributions in terms of improving the filter performances through the attenuation increase at high frequency considering also the parasitic effects minimization. Thus, in order to increase the attenuation at high frequency the use of nickel platting method on the copper conductors is proposed, method which will be tested on a low-pass filter constructed in planar electromagnetic technology.
Keywords
conductors (electric); copper; electromagnetic devices; electroplating; integrated circuit design; low-pass filters; nickel; planarisation; Cu; Ni; copper conductors; nickel plating method; parasitic effects minimization; planar electromagnetic technology; planar integrated low pass filter; attenuation in high frequency; parasite effects; planar electromagnetic technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical and Power Engineering (EPE), 2014 International Conference and Exposition on
Conference_Location
Iasi
Type
conf
DOI
10.1109/ICEPE.2014.6969983
Filename
6969983
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