• DocumentCode
    167930
  • Title

    Methods for planar integrated low pass filter performance improvements in high frequency

  • Author

    Racasan, A. ; Munteanu, C. ; Topa, V. ; Pacurar, C. ; Hebedean, C. ; Cislariu, M.

  • Author_Institution
    Dept. of Electrotechnics & Meas., Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania
  • fYear
    2014
  • fDate
    16-18 Oct. 2014
  • Firstpage
    617
  • Lastpage
    621
  • Abstract
    The improvement of the performances of a filter involves two major research directions: the first one refers to the attenuation increase (through the increase of the losses) at high frequency and the second one refers to the suppression of the parasitic effects from the constitutive devices. In this light, this paper presents the authors contributions in terms of improving the filter performances through the attenuation increase at high frequency considering also the parasitic effects minimization. Thus, in order to increase the attenuation at high frequency the use of nickel platting method on the copper conductors is proposed, method which will be tested on a low-pass filter constructed in planar electromagnetic technology.
  • Keywords
    conductors (electric); copper; electromagnetic devices; electroplating; integrated circuit design; low-pass filters; nickel; planarisation; Cu; Ni; copper conductors; nickel plating method; parasitic effects minimization; planar electromagnetic technology; planar integrated low pass filter; attenuation in high frequency; parasite effects; planar electromagnetic technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Power Engineering (EPE), 2014 International Conference and Exposition on
  • Conference_Location
    Iasi
  • Type

    conf

  • DOI
    10.1109/ICEPE.2014.6969983
  • Filename
    6969983