DocumentCode
1679756
Title
Full-wave analysis of various coplanar bends and T-junctions with respect to different types of air-bridges
Author
Becks, T. ; Wolff, I.
Author_Institution
Inst. for Mobile & Satellite Commun. Tech., Kamp-Lintfort, Germany
fYear
1993
Firstpage
697
Abstract
Various types of air bridges within bends and T-junctions are innvestigated using an extension of the spectral domain analysis method for analyzing three-dimensional metallization structures. Generalized scattering parameters are calculated to compare the different bridge layouts. In order to check the accuracy of the algorithm, four coplanar T-junctions on a GaAs substrate containing three standard air bridges and one modified air bridge have been built and measured. For the even mode scattering parameters, a very good agreement over the whole frequency range, compared to the calculated results, is obtained. Various data for conversion from the even mode to the odd mode within these structures are also given. As a result of the investigations, some design ideas for coplanar waveguide (CPW) circuit designers are determined. Problems in coplanar measurements using probe tips are discussed.<>
Keywords
MMIC; S-parameters; microstrip components; spectral-domain analysis; CPW circuits; GaAs substrate; T-junctions; air-bridges; bridge layouts; coplanar bends; coplanar measurements; coplanar waveguide; even-mode S-parameters; full wave analysis; odd mode; probe tips; scattering parameters; spectral domain analysis; three-dimensional metallization structures; Apertures; Circuits; Conductors; Coplanar waveguides; Electromagnetic waveguides; Finite difference methods; Magnetic separation; Metallization; Microstrip; Scattering parameters;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1993., IEEE MTT-S International
Conference_Location
Atlanta, GA, USA
ISSN
0149-645X
Print_ISBN
0-7803-1209-0
Type
conf
DOI
10.1109/MWSYM.1993.277003
Filename
277003
Link To Document