3D characterization of air bridges and via holes in conductor-backed coplanar waveguides for MMIC applications

Author

Visan, S. ; Picon, O. ; Fouad Hanna, V.

Author_Institution

France Telecom-CNET, Issy-les-Moulineaux, France

fYear

1993

Firstpage

709

Abstract

A 3-D finite-difference time-domain (FDTD) method is used to characterize an air bridge and two via holes which can be used in a conductor-backed coplanar waveguide (CPW) to suppress the coupled slotlinelike mode. The accuracy of the analysis is demonstrated through a comparison of theoretical results obtained using the FDTD method to experimental results for a via hole ground in a microstrip. It is shown that the via hole discontinuity in a conductor-backed CPW is associated with reflection losses lower than those for an air bridge discontinuity. In both cases the CPW keeps its advantage of easy adaptation to both series and shunt element connections.<>

Keywords

MMIC; finite difference time-domain analysis; losses; microstrip components; 3D characterization; FDTD; MMIC applications; air bridges; conductor-backed CPW; coplanar waveguides; coupled slotlinelike mode; finite-difference time-domain; hole discontinuity; reflection losses; via holes; Bridge circuits; Conductors; Coplanar waveguides; Finite difference methods; Frequency; MMICs; Microstrip; Power transmission lines; Slotline; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1993., IEEE MTT-S International

Conference_Location

Atlanta, GA, USA

ISSN

0149-645X

Print_ISBN

0-7803-1209-0

Type

conf

DOI

10.1109/MWSYM.1993.277006

Filename

277006