• DocumentCode
    1680059
  • Title

    Chip-to-Chip Inductive Wireless Power Transmission System for SiP Applications

  • Author

    Onizuka, Kohei ; Kawaguchi, Hiroshi ; Takamiya, Makoto ; Kuroda, Tadahiro ; Sakurai, Takayasu

  • Author_Institution
    Inst. of Ind. Sci., Tokyo Univ.
  • fYear
    2006
  • Firstpage
    575
  • Lastpage
    578
  • Abstract
    A chip-to-chip inductive wireless power transmission system is proposed and the feasibility is experimentally demonstrated for the first time. The circuit realized 2.5mW power transmission at the output DC voltage of 0.5V using 700 times 700mum on-chip planar inductors for the transmitter and the receiver. Methods to optimize the circuit design about the maximum transmission power and the simulated optimization results are discussed
  • Keywords
    inductive power transmission; integrated circuit design; system-in-package; 0.5 V; 2.5 mW; SiP applications; chip-to-chip inductive wireless power transmission system; circuit design; maximum transmission power; Bonding; Circuits; Costs; Data communication; Diodes; Fabrication; Inductors; Power transmission; Radio transmitters; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2006. CICC '06. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    1-4244-0075-9
  • Electronic_ISBN
    1-4244-0076-7
  • Type

    conf

  • DOI
    10.1109/CICC.2006.320994
  • Filename
    4115025
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1680059