DocumentCode
1680869
Title
Electrical Characteristic Fluctuations in Sub-45nm CMOS Devices
Author
Yang, Fu-Liang ; Hwang, Jiunn-Ren ; Li, Yiming
Author_Institution
Taiwan Semicond. Manuf. Co., Hsinchu City
fYear
2006
Firstpage
691
Lastpage
694
Abstract
Random fluctuations of electrical characteristics in sub-45nm CMOS devices introduced by process-parameter variations through severe short channel effects have made the scaling of conventional planar transistors much more difficult than ever before, especially while further reduction of gate dielectric thickness is ambiguous. In this paper, the authors systematically investigate the fluctuations of threshold voltages at varied gate length, considering the effects of channel doping, gate dielectric thickness, and new transistor structures such as thin-buried-oxide SOI and FinFETs. Quantitative analysis is undertaken in terms of three major variation sources: random doping distribution, gate length deviation, and line edge roughness. The analysis also features a low Vt-fluctuation transistor for 16nm node achieved with undoped body, mid-gap metal gate, and nanowire channel
Keywords
CMOS integrated circuits; MOSFET; current fluctuations; doping; nanowires; silicon-on-insulator; CMOS devices; FinFET; channel doping; electrical characteristic fluctuations; mid-gap metal gate; nanowire channel; process-parameter variations; random fluctuations; thin-buried-oxide SOI; undoped body; CMOS technology; Circuits; Dielectric substrates; Doping; Electric variables; FinFETs; Fluctuations; High K dielectric materials; MOSFETs; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 2006. CICC '06. IEEE
Conference_Location
San Jose, CA
Print_ISBN
1-4244-0075-9
Electronic_ISBN
1-4244-0076-7
Type
conf
DOI
10.1109/CICC.2006.320881
Filename
4115050
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