Design and optimization of embedded power chip modules for double-sided cooling

This work presents a simple experimental method to obtain accurate characterization of double-sided cooling in single embedded power chip modules (EPCM), based on a simple experimental method using temperature cooling-down curve measurement. A one-dimensional thermal network is employed to describe the thermal characterizations of all layers and inter-layers of the single power packaging chip modules. 3-D simulation by means of Ideas software is used to evaluate the accuracy of the one-dimensional thermal network. The experimental based one-dimensional thermal network is shown to provide a powerful tool for the design and optimization of the embedded power chip packaging for double-sided cooling.