DocumentCode
1681813
Title
EDA Challenges in Nano-scale Technology
Author
Kawa, Jamil ; Chiang, Charles ; Camposano, Raul
Author_Institution
Synopsys, Inc., Mountain View, CA
fYear
2006
Firstpage
845
Lastpage
851
Abstract
Since the onset of the 90 nm node the challenges associated with further transistor scaling while maintaining a consistently functional, reliable, and yielding design have increased substantially. While those challenges carry across the spectrum of the manufacturing, the EDA, and the design communities, we believe it is the responsibility and the goal of the EDA industry to deal with those issues as thoroughly and as seamlessly as possible to make those challenges transparent to the designer. In this paper we expose and analyze a plurality of those challenges and briefly go over the solutions EDA tools are offering for dealing with them. We also look forward and cover some of the future challenges associated with the integration of the emerging bottoms-up nano-materials flow with the traditional CMOS top-down process flow which has also entered the nano-era
Keywords
CMOS integrated circuits; electronic design automation; nanotechnology; 90 nm; CMOS top-down process flow; EDA tools; bottoms-up nanomaterials; electronic design automation; nanoscale technology; Chemical technology; Circuits; Copper; Electronic design automation and methodology; Inorganic materials; Lithography; Manufacturing processes; Semiconductor materials; Stress; USA Councils;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 2006. CICC '06. IEEE
Conference_Location
San Jose, CA
Print_ISBN
1-4244-0075-9
Electronic_ISBN
1-4244-0076-7
Type
conf
DOI
10.1109/CICC.2006.320844
Filename
4115085
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