• DocumentCode
    1682752
  • Title

    System-level, thermal-aware, fully-loaded process scheduling

  • Author

    Li, Dong ; Chang, Hung-Ching ; Pyla, Hari K. ; Cameron, Kirk W.

  • Author_Institution
    Dept. of Comput. Sci., Virginia Tech, Blacksburg, VA
  • fYear
    2008
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Processor power consumption produces significant heat and can result in higher average operating temperatures. High operating temperatures can lead to reduced reliability and at times thermal emergencies. Previous thermal-aware techniques use dynamic voltage and frequency scaling (DVFS) or multithreaded or multicore process migration to reduce thermals. However, these methods do not gracefully handle scenarios where processors are fully loaded, i.e. there are no free threads or cores for process scheduling. We propose techniques to reduce processor temperature when processors are fully loaded. We use system-level compiler support and dynamic runtime instrumentation to identify the relative thermal intensity of processes. We implement a thermal-aware process scheduling algorithm that reduces processor thermals while maintaining application throughput. We favor "cool" processes by reducing time slice allocations for "hot" processes. Results indicate that our thermal-aware scheduling can reduce processor thermals by up to 3 degrees Celsius with little to no loss in application throughput.
  • Keywords
    multi-threading; power aware computing; processor scheduling; program compilers; dynamic frequency scaling; dynamic voltage scaling; multicore process migration; multithreaded process migration; process scheduling; processor power consumption; thermal-aware process scheduling algorithm; Dynamic compiler; Dynamic voltage scaling; Energy consumption; Frequency; Multicore processing; Power system reliability; Processor scheduling; Temperature; Throughput; Yarn;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Parallel and Distributed Processing, 2008. IPDPS 2008. IEEE International Symposium on
  • Conference_Location
    Miami, FL
  • ISSN
    1530-2075
  • Print_ISBN
    978-1-4244-1693-6
  • Electronic_ISBN
    1530-2075
  • Type

    conf

  • DOI
    10.1109/IPDPS.2008.4536225
  • Filename
    4536225