• DocumentCode
    1683737
  • Title

    Degradation of electrical properties of organic industrial laminates due to moisture absorption

  • Author

    Sumangala, M.G. ; Poovamma, P.K. ; Dwarakanath, K. ; Sastry, K. S Arunachala ; Ratra, M.C.

  • Author_Institution
    Central Power Res. Inst., Bangalore, India
  • fYear
    1989
  • Firstpage
    484
  • Lastpage
    488
  • Abstract
    The influence on certain important electrical properties such as insulation resistance, breakdown voltage, comparative tracking index (CTI), and arc resistance in industrial organic laminates is discussed. Four different types of laminates-paper phenolic, glass-epoxy, glass-melanine, and sheet molding compounds-were selected for the investigation. The influence of araldite coating on the sides of the specimens was also investigated for some of the properties mentioned above. It is shown that glass-epoxy laminates and paper phenolic laminates exhibit very good and very poor performance, respectively. The behavior of CTI and the arc resistance of the laminates with respect to electrode material suggest that the physical processes responsible for the degradation of the material are entirely different than for the other properties. The araldite coating did not improve the properties. Instead it had an adverse effect on most of the characteristics
  • Keywords
    arcs (electric); composite insulating materials; electric breakdown of solids; filled polymers; insulation testing; laminates; paper; sorption; araldite coating; arc resistance; breakdown voltage; comparative tracking index; glass-epoxy; glass-melanine; insulation resistance; moisture absorption; organic industrial laminates; paper phenolic; sheet molding compounds; Electrical resistance measurement; Electrodes; Electromagnetic wave absorption; Glass; Humidity; Laminates; Moisture; Resins; Sliding mode control; Thermal degradation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Conduction and Breakdown in Solid Dielectrics, 1989., Proceedings of the 3rd International Conference on
  • Conference_Location
    Trondheim
  • Type

    conf

  • DOI
    10.1109/ICSD.1989.69246
  • Filename
    69246