• DocumentCode
    1687672
  • Title

    On-die Decoupling Capacitor Measurement Using Vector Network Analyzer

  • Author

    Guo, Fei ; Frankovich, Mark

  • Author_Institution
    ATI Technol., Markham, Ont.
  • fYear
    2006
  • Firstpage
    25
  • Lastpage
    28
  • Abstract
    This paper describes a technique for characterizing on-die core power networks using package level vector network analyzer (VNA) S21 measurements. The technique uses the two-port self-impedance measurement concept for low impedance power distribution networks (PDN) (Novak, 2000). It is validated mathematically through network analysis and makes use of an auxiliary test fixture to de-embed the chip packaging parasitic resistance and inductance. The nature of the device under test (DUT) requires specific calibration and measurement considerations to ensure accurate low impedance (sub-milliohm) measurements. Measurements and equivalent circuit models of a sample are presented to show the effectiveness of the methodology
  • Keywords
    capacitance measurement; capacitors; equivalent circuits; network analysers; power supply circuits; S21 measurements; chip packaging; core power networks; device under test; equivalent circuit models; low impedance power distribution networks; on-die decoupling capacitor measurement; package level vector network analyzer; two-port self-impedance measurement concept; Capacitors; Circuit testing; Electrical resistance measurement; Fixtures; Impedance measurement; Inductance; Packaging; Power measurement; Power systems; Semiconductor device measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2006 IEEE
  • Conference_Location
    Scottsdale, AZ
  • Print_ISBN
    1-4244-0668-4
  • Type

    conf

  • DOI
    10.1109/EPEP.2006.321181
  • Filename
    4115341