DocumentCode
1688452
Title
On the Effect of Mobile Device Shape Characteristics to Interconnection Noise Coupling to an RF Chip Antenna
Author
Hynynen, Lauri ; Tarvainen, Timo ; Rouvala, Markku ; Renko, Antti
Author_Institution
Esju Oy, Oulu
fYear
2006
Firstpage
127
Lastpage
130
Abstract
Digital interconnections in mobile devices can cause radiative coupling to RF antennas and devices. This paper discusses measurements and modeling of coupling from a digital interconnection to an RF chip antenna with various positional and device shape characteristics
Keywords
integrated circuit interconnections; integrated circuit noise; microwave antennas; coupling measurements; coupling modeling; digital interconnections; interconnection noise coupling; mobile device; radiative coupling; radiofrequency chip antenna; shape characteristics; Antenna measurements; Crosstalk; Integrated circuit interconnections; Mobile antennas; Noise measurement; Noise shaping; Position measurement; Radio frequency; Scattering parameters; Shape;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location
Scottsdale, AZ
Print_ISBN
1-4244-0668-4
Type
conf
DOI
10.1109/EPEP.2006.321208
Filename
4115368
Link To Document