• DocumentCode
    1688806
  • Title

    3D micro-optomechanical devices by surface tension powered self-assembly

  • Author

    Syms, Richard R. A.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Imperial Coll. of Sci., Technol. & Med., London
  • fYear
    1999
  • fDate
    6/21/1905 12:00:00 AM
  • Firstpage
    42461
  • Lastpage
    42466
  • Abstract
    Surface tension self-assembly has been shown to be a versatile technique for accurate, massparallel assembly of 3D microengineered structures. It is particularly suited for construction of devices which require features to be patterned and set up out of the wafer plane, such as opto-MEMS devices. However, analogous applications exist for beam processing elements in microengineered electron and ion optical systems
  • Keywords
    surface tension; 3D micro-optomechanical devices; 3D microengineered structures; accurate massparallel assembly; analogous applications; beam processing elements; ion optical systems; microengineered electron systems; opto-MEMS devices; patterned feature devices; surface tension powered self-assembly; surface tension self-assembly; wafer plane;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Microengineering in Optics and Optoelectronics (Ref. No. 1999/187), IEE Colloquium on
  • Conference_Location
    London
  • Type

    conf

  • DOI
    10.1049/ic:19990865
  • Filename
    827117
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1688806