• DocumentCode
    1688851
  • Title

    Deformation sensitivity mechanisms of molybdenum-silicon Schottky diodes

  • Author

    Fastykovsky, Pevpel P.

  • Author_Institution
    Mechnikov State Univ., Odessa, Ukraine
  • fYear
    1992
  • Firstpage
    61
  • Abstract
    The influence of uniaxial deformation on Mo-nn+Si Schottky diode reverse I-U characteristics has been investigated. Strain sensitivity of the reverse current is shown to be connected with the degree of imperfection of the silicon layer near the surface. The highest strain sensitivity is found in the diodes, whose silicon layer near the surface contains local dislocation clusters of increased density. This is associated with the resonant tunneling current flowing in the diodes, whose dependence on the strain and bias voltage is stronger than that of the thermionic current
  • Keywords
    Schottky-barrier diodes; deformation; molybdenum; semiconductor device testing; semiconductor materials; silicon; Mo-Si; Schottky diodes; bias voltage; local dislocation clusters; resonant tunneling current; reverse I-U characteristics; reverse current; semiconductor device testing; strain sensitivity; thermionic current; uniaxial deformation; Capacitive sensors; Fabrication; Production; Resonant tunneling devices; Schottky diodes; Silicon; Strain measurement; Temperature distribution; Temperature sensors; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics, 1992., Proceedings of the IEEE International Symposium on
  • Conference_Location
    Xian
  • Print_ISBN
    0-7803-0042-4
  • Type

    conf

  • DOI
    10.1109/ISIE.1992.279618
  • Filename
    279618