• DocumentCode
    1689064
  • Title

    Delay-Based Macromodels for Long Interconnects via Time-Frequency Decompositions

  • Author

    Talocia, S. Grivet

  • Author_Institution
    Dip. Elettronica, Politecnico di Torino
  • fYear
    2006
  • Firstpage
    199
  • Lastpage
    202
  • Abstract
    We introduce a new macromodeling scheme for electrically long interconnects characterized by tabulated frequency responses. The transfer function of the interconnect is modeled as a superposition of multiple single-delay atoms, which are identified via a selective inversion of a Gabor transform of the raw frequency data. Each atom is then approximated by a delayed rational function, leading to a highly-efficient SPICE-ready macromodel
  • Keywords
    SPICE; integrated circuit interconnections; integrated circuit modelling; transfer functions; Gabor transform; SPICE; delay based macromodels; long interconnects; macromodeling scheme; multiple single delay atoms; selective inversion; tabulated frequency responses; time frequency decompositions; transfer function; Atomic measurements; Electromagnetic scattering; Electronics packaging; Frequency measurement; Propagation delay; Time domain analysis; Time frequency analysis; Transfer functions; Transmission line matrix methods; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2006 IEEE
  • Conference_Location
    Scottsdale, AZ
  • Print_ISBN
    1-4244-0668-4
  • Type

    conf

  • DOI
    10.1109/EPEP.2006.321228
  • Filename
    4115388