DocumentCode
1689064
Title
Delay-Based Macromodels for Long Interconnects via Time-Frequency Decompositions
Author
Talocia, S. Grivet
Author_Institution
Dip. Elettronica, Politecnico di Torino
fYear
2006
Firstpage
199
Lastpage
202
Abstract
We introduce a new macromodeling scheme for electrically long interconnects characterized by tabulated frequency responses. The transfer function of the interconnect is modeled as a superposition of multiple single-delay atoms, which are identified via a selective inversion of a Gabor transform of the raw frequency data. Each atom is then approximated by a delayed rational function, leading to a highly-efficient SPICE-ready macromodel
Keywords
SPICE; integrated circuit interconnections; integrated circuit modelling; transfer functions; Gabor transform; SPICE; delay based macromodels; long interconnects; macromodeling scheme; multiple single delay atoms; selective inversion; tabulated frequency responses; time frequency decompositions; transfer function; Atomic measurements; Electromagnetic scattering; Electronics packaging; Frequency measurement; Propagation delay; Time domain analysis; Time frequency analysis; Transfer functions; Transmission line matrix methods; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2006 IEEE
Conference_Location
Scottsdale, AZ
Print_ISBN
1-4244-0668-4
Type
conf
DOI
10.1109/EPEP.2006.321228
Filename
4115388
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