DocumentCode
1689291
Title
A test methodology to support an ASEM MCM foundry
Author
Storey, T. ; Lapihuska, C. ; Atwood, E. ; Su, L.
Author_Institution
Loral Federal Syst., Manassas, VA, USA
fYear
34608
Firstpage
426
Lastpage
435
Abstract
MCM testing can be challenging enough when the chip, substrate, and MCM design are within the control of the same company. In the foundry environment, however, even more robust strategies must be adopted. In this paper a test methodology is described which consolidates the various MCM test stages to form a flexible, low-cost, quick turn-around-time test flow
Keywords
application specific integrated circuits; automatic testing; integrated circuit interconnections; integrated circuit testing; multichip modules; substrates; ARPA; ASEM MCM foundry; Application Specific Electronic Modules; MCM testing; chip internal test; die test; distributed testing; flexible low-cost testing; functional test; interconnect test; multichip module; robust strategies; standards; substrate test; test methodology; Costs; Fault detection; Foundries; Life testing; Manufacturing; Microelectronics; Military standards; Packaging; Production facilities; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1994. Proceedings., International
Conference_Location
Washington, DC
ISSN
1089-3539
Print_ISBN
0-7803-2103-0
Type
conf
DOI
10.1109/TEST.1994.527984
Filename
527984
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