High-density and very fine-pitch IC packages: a technology assessment

To meet the technological challenges of the future in terms of device performance and miniaturization, a number of IC packages have been developed in the industry, with very high levels of integration. The distinguishing features of these packages include high density, small profile, very fine lead spacings, and superior electrical and thermal characteristics. The author provides a comparative assessment of these IC packages, he also discusses various issues posed by these packaging configurations to the surface-mount assembly world. About 25 different packaging formats and their various derivatives are analyzed from a manufacturing perspective. According to this assessment, the Japanese-styled metric quad flat-packs using pre-formed leads and tape automated bonding are emerging as the technology of choice for high density, high I/O, and very fine-pitch packaging