Mounting of laser bars on copper heat sinks using Au/Sn solder and CuW submounts

Author

Pittroff, W. ; Erbert, G. ; Klein, A. ; Staske, R. ; Sumpf, B. ; Traenkle, G.

Author_Institution

Ferdinand-Braun-Inst. fur Hochsfrequenstech., Berlin, Germany

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

276

Lastpage

281

Abstract

GaAs high power diode laser bars were mounted on CuW submounts using an optimized Au(80)Sn(20) solder. During soldering the dissolution of an additional Au layer placed on the die caused the growth of the gold rich ζ-phase in the solder and thus an isothermal solidification. The laser bars on CuW submounts were mounted on passively cooled Cu heat sinks using a Pb(37)Sn(63) solder. After mounting, the degradation of 800 nm and 960 nm laser bars operated at 30 W and 45 W, respectively, was examined. Degradation rates less than 10^-5 h^-1 have been obtained. Measurements of stress distribution and failure analysis after aging have been performed.

Keywords

III-V semiconductors; ageing; cooling; copper; copper alloys; failure analysis; gallium arsenide; gold alloys; heat sinks; lead alloys; semiconductor device packaging; semiconductor device reliability; semiconductor lasers; soldering; stress analysis; thermal management (packaging); thermal resistance; tin alloys; tungsten alloys; 30 W; 45 W; 800 nm; 960 nm; Au layer; Au rich ζ-phase; Au-Sn; Cu; Cu-W; CuW submounts; GaAs diode laser bars; Pb(37)Sn(63) solder; Pb-Sn; aging; failure analysis; high power laser bars; isothermal solidification; laser bar degradation; laser mounting; optimized Au(80)Sn(20) solder; passively cooled Cu heat sinks; stress distribution; thermal resistance; Bars; Copper; Degradation; Diode lasers; Gallium arsenide; Gold; Heat sinks; Isothermal processes; Soldering; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

ISSN

0569-5503

Print_ISBN

0-7803-7430-4

Type

conf

DOI

10.1109/ECTC.2002.1008107

Filename

1008107