Equipment and process decisions for the manufacture of multi-chip modules (MCMs)

Author

Gardner, Robert

Author_Institution

Microelectronics & Computer Technology Corp., Austin, TX, USA

fYear

1991

Firstpage

419

Abstract

Summary form only given. The author discusses issues that face the engineering staff planning a manufacturing line for a processor module containing processor chips and cache memory, targeting an assembly line throughput of 3000 modules per month. Equipment and process requirements include treatment of fine-pitch, face-up solder tape automated bonding; wire bonding; die-attach dispense for heat transfer; passive device attach; rework and repair of device; post-solder non-CFC cleaning; cleaning room environment; handling of boards; burn-in; and electrical test

Keywords

hybrid integrated circuits; integrated circuit manufacture; modules; production testing; surface treatment; tape automated bonding; MCMs; assembly line throughput; burn-in; cache memory; cleaning room environment; die-attach dispense; electrical test; face-up solder tape automated bonding; fine-pitch; handling; heat transfer; manufacturing line; multi-chip modules; passive device attach; post-solder cleaning; processor chips; processor module; repair; rework; wire bonding; Assembly; Bonding; Cache memory; Cleaning; Heat treatment; Manufacturing processes; Process planning; Resistance heating; Throughput; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1991., Eleventh IEEE/CHMT International

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-0155-2

Type

conf

DOI

10.1109/IEMT.1991.279828

Filename

279828