DocumentCode
1694600
Title
Could shock tests adequately mimic drop test conditions?
Author
Suhir, E.
Author_Institution
Iolon Inc., San Jose, CA, USA
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
563
Lastpage
573
Abstract
Drop tests are often substituted in qualification or life testing of microelectronic and optoelectronic products by shock tests. The existing (e.g., Telcordia) qualification specifications require that a short term load of the given magnitude and duration (say, an "external" acceleration with the maximum value of 500 g, acting for 0.001 s) is applied to the support structure of the product under tests. The natural frequencies of vibration are not taken into account. The objective of our study is to develop simple analytical ("mathematical") predictive models for the evaluation of the dynamic response of a structural element in a microelectronic or an optoelectronic product/package to an impact load occurring as a result of drop or shock tests. We use the developed models to find out if a shock tester could be "tuned" in such a way that the shock tests would adequately mimic drop test conditions. We suggest that the maximum induced curvature and the maximum induced acceleration be used as suitable characteristics of the dynamic response of a structural element to an impact load. The results of the analysis can be helpful in physical design and qualification testing of microelectronic and photonic products, experiencing dynamic loads of short duration.
Keywords
dynamic testing; impact testing; life testing; reliability; shock measurement; dynamic response; impact load; life testing; maximum induced acceleration; maximum induced curvature; microelectronic products; photonic products; predictive models; qualification testing; shock tests; short term load; structural element; support structure; Acceleration; Electric shock; Frequency; Impulse testing; Life estimation; Life testing; Microelectronics; Predictive models; Qualifications; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN
0569-5503
Print_ISBN
0-7803-7430-4
Type
conf
DOI
10.1109/ECTC.2002.1008151
Filename
1008151
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