DocumentCode
1695093
Title
Reel-to-reel manufacturability of flexible electrical interconnects and radio-frequency identification structures
Author
Lochun, Darren ; Zeira, Eitan ; Menize, Robert
Author_Institution
Specialty Paper Products Div., Nashua Corp., Merrimack, NH, USA
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
686
Lastpage
689
Abstract
We report a reel-to-reel manufacturing method for flexible electrical interconnects with copper conductivity that can be attained from a two-stage process of printing and electrolytic plating. This process can rapidly manufacture a range of patterns that can be applied to single sided circuitry including radio frequency identification structures. We disclose a method to print a material on a reel-to-reel printer that has sufficient conductivity to allow subsequent electrolytic plating on a reel-to-reel processing line and have sufficient ink/substrate adhesion to withstand the aggressiveness of the electrolytic plating chemistry, Depending on the printing technology chosen speeds of 150 feet per minute (fpm) to 300 fpm can be readily achieved. Judicious choice of image design will facilitate reel-to-reel electrolytic plating on a dedicated line. Electrolytic plating will occur only on connected lines and is therefore an additive technology eliminating the requirement for an etching step and so reducing the environmental impact of printed circuit manufacture.
Keywords
adhesion; electroplating; identification technology; printed circuit manufacture; 9000 to 18000 ft/s; dedicated line; electrolytic plating; flexible electrical interconnects; ink/substrate adhesion; plating chemistry; printed circuit manufacture; radio-frequency identification structures; reel-to-reel manufacturability; single sided circuitry; two-stage process; Chemical technology; Conducting materials; Conductivity; Copper; Flexible manufacturing systems; Integrated circuit interconnections; Manufacturing processes; Printing; Radio frequency; Radiofrequency identification;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN
0569-5503
Print_ISBN
0-7803-7430-4
Type
conf
DOI
10.1109/ECTC.2002.1008172
Filename
1008172
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