Parameter sensitivity study of cure-dependent underfill properties on flip chip failures

Author

Yang, D.G. ; Zhang, G.Q. ; van Driel, W. ; Janssen, J. ; Bressers, H.J.L. ; Ernst, L.J.

Author_Institution

Delft Univ. of Technol., Netherlands

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

865

Lastpage

872

Abstract

A parameter sensitivity study directed to the effects of cure-dependent underfill properties on Flip Chip\´s die cracking and solder fatigue lifetime is presented. The cure dependent behavior is modeled with a modified version of an earlier published cure dependent viscoelastic model. In the modified model the cure-dependent "equilibrium" shear- and bulk-moduli are modified compared to the original description. The developed FEM models for die cracking and solder fatigue are integrated with a sequential type of Design of Experiments (DOE). Two response surface models (RSM\´s), one for die cracking, the other for solder fatigue lifetime, are established using the obtained FEM simulation results. The developed RSM\´s are employed to conduct a parameter sensitivity study.

Keywords

design of experiments; elastic moduli; failure analysis; fatigue cracks; finite element analysis; flip-chip devices; integrated circuit reliability; soldering; FEM models; bulk moduli; cure-dependent underfill; design of experiments; die cracking; flip chips; parameter sensitivity; response surface models; shear moduli; solder fatigue; solder fatigue lifetime; viscoelastic model; Capacitive sensors; Curing; Elasticity; Fatigue; Flip chip; Mechanical factors; Packaging; Polymers; Thermomechanical processes; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

ISSN

0569-5503

Print_ISBN

0-7803-7430-4

Type

conf

DOI

10.1109/ECTC.2002.1008202

Filename

1008202