Effect of strain rate on solder joint failure under mechanical load

Author

Geng, Phil ; Chen, Philip ; Ling, Yun

Author_Institution

Intel Corp., Hillsboro, OR, USA

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

974

Lastpage

978

Abstract

A four-point bend test fixture and a daisy-chained test coupon with BGA mounted at 45-degree orientation were developed to evaluate solder joint failure through a simple test and finite element modeling procedure. The bending test was performed under various loading speed. The BGAs tested have 1.27 mm and 1.00 mm pitches, respectively. One of the significant findings is that the solder joints failure is highly strain rate dependent. At higher strain rate, solder joint failed at much less board deflection for some BGAs. This indicates that the common practice of quasi-static bending test is not sufficient to quantify the solder joint failure under shock load.

Keywords

ball grid arrays; bending; failure analysis; finite element analysis; mechanical testing; soldering; 1.00 mm; 1.27 mm; BGA package; daisy-chained test coupon; finite element model; four-point bend test fixture; mechanical load; quasi-static bending test; shock load; solder joint failure; strain rate; Capacitive sensors; Electric shock; Finite element methods; Fixtures; Performance evaluation; Soldering; Strain measurement; System testing; Tensile strain; Tensile stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

ISSN

0569-5503

Print_ISBN

0-7803-7430-4

Type

conf

DOI

10.1109/ECTC.2002.1008219

Filename

1008219