Deterioration mechanism of flip chip attachment using an anisotropic conductive film and design technology for high reliability

Author

Fujiwara, Shinichi ; Harada, Masahide ; Fujita, Yuji ; Hachiya, Toshihiro ; Muramatsu, Morio

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

1124

Lastpage

1129

Abstract

The flip-chip technique, in which a bare chip is directly connected to a substrate, has become a key technology in producing compact electronic products, including cellular phones. In particular, the technique of using Au bumps to connect the bare chip with the substrate, with the aid of an anisotropic conductive film (ACF), is one of the most useful technologies. The most serious problem with ACF bonding technology today is that the deterioration mechanism of interconnections is not clear. This study is motivated to clarify the mechanism of deterioration and to establish the method of obtaining reliability in the design of interconnections for which ACF is used.

Keywords

assembling; conducting polymers; flip-chip devices; gold; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; multichip modules; ACF; Au; Au bumps; anisotropic conductive film; bare chip direct connection; cellular phones; compact electronic products; flip chip attachment deterioration mechanism; flip-chip technique; high reliability design technology; interconnection design reliability; interconnection deterioration mechanism; Anisotropic conductive films; Contacts; Flip chip; Gold; Laboratories; Production engineering; Substrates; Temperature; Testing; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

ISSN

0569-5503

Print_ISBN

0-7803-7430-4

Type

conf

DOI

10.1109/ECTC.2002.1008244

Filename

1008244