DocumentCode
1697207
Title
A novel micromachining technology for structuring borosilicate glass substrates
Author
Merz, P. ; Quenzer, H.J. ; Bernt, H. ; Wanger, B. ; Zoberbier, M.
Author_Institution
Fraunhofer Inst. for Silicon Technol., Itzehoe, Germany
Volume
1
fYear
2003
Firstpage
258
Abstract
We present a novel process technology, which enables precision micro machining of glass wafers. With this Glass Flow Process GFP which is based on viscous deformation at temperatures above the glass transition temperature T/sub g/, any surface topography available on a silicon substrate can be moulded into Borosilicate glasses, especially into bondable glasses like Borofloat or Pyrex. Beside the replication of silicon structures this technique allows the fabrication of optical micro lens arrays with high aspect ratios and minimum spacing. Introducing this GFP technology to MEMS processing enables the deep structuring of glass substrates and opens a wide range of new applications. Optical quality micro lenses with saggital heights above 100 /spl mu/m are demonstrated. In this paper an insight description of the GFP technology is given and the functionality of this new technology is presented by optical measurements of micro lens demonstrators.
Keywords
borosilicate glasses; deformation; glass transition; microlenses; micromachining; micromechanical devices; optical arrays; surface topography; B/sub 2/O/sub 3/-SiO/sub 2/; MEMS; Si; borofloat glass; borosilicate glass substrate; glass flow process; glass substrates; glass transition; glass wafer; micro lens demonstrator; micromachining; optical micro lens arrays; pyrex glass; silicon substrate; surface topography; viscous deformation; Glass; Lenses; Machining; Micromachining; Optical arrays; Optical device fabrication; Silicon; Surface topography; Temperature; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-7731-1
Type
conf
DOI
10.1109/SENSOR.2003.1215302
Filename
1215302
Link To Document