• DocumentCode
    1697207
  • Title

    A novel micromachining technology for structuring borosilicate glass substrates

  • Author

    Merz, P. ; Quenzer, H.J. ; Bernt, H. ; Wanger, B. ; Zoberbier, M.

  • Author_Institution
    Fraunhofer Inst. for Silicon Technol., Itzehoe, Germany
  • Volume
    1
  • fYear
    2003
  • Firstpage
    258
  • Abstract
    We present a novel process technology, which enables precision micro machining of glass wafers. With this Glass Flow Process GFP which is based on viscous deformation at temperatures above the glass transition temperature T/sub g/, any surface topography available on a silicon substrate can be moulded into Borosilicate glasses, especially into bondable glasses like Borofloat or Pyrex. Beside the replication of silicon structures this technique allows the fabrication of optical micro lens arrays with high aspect ratios and minimum spacing. Introducing this GFP technology to MEMS processing enables the deep structuring of glass substrates and opens a wide range of new applications. Optical quality micro lenses with saggital heights above 100 /spl mu/m are demonstrated. In this paper an insight description of the GFP technology is given and the functionality of this new technology is presented by optical measurements of micro lens demonstrators.
  • Keywords
    borosilicate glasses; deformation; glass transition; microlenses; micromachining; micromechanical devices; optical arrays; surface topography; B/sub 2/O/sub 3/-SiO/sub 2/; MEMS; Si; borofloat glass; borosilicate glass substrate; glass flow process; glass substrates; glass transition; glass wafer; micro lens demonstrator; micromachining; optical micro lens arrays; pyrex glass; silicon substrate; surface topography; viscous deformation; Glass; Lenses; Machining; Micromachining; Optical arrays; Optical device fabrication; Silicon; Surface topography; Temperature; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003
  • Conference_Location
    Boston, MA, USA
  • Print_ISBN
    0-7803-7731-1
  • Type

    conf

  • DOI
    10.1109/SENSOR.2003.1215302
  • Filename
    1215302