Hands-on module packaging education at Georgia Tech

Author

Doraiswami, Ravi ; Li, Jing ; Bhattacharya, Swapan K. ; Conrad, Leyla ; May, Gary S. ; Tummala, Rao R.

Author_Institution

Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2002

fDate

6/24/1905 12:00:00 AM

Firstpage

1517

Lastpage

1523

Abstract

The Design Build and Operate (DBO) course at PRC (the Packaging Research Center at Georgia Institute of Technology) provides hands-on experience in SOP (System on a Package) packaging for undergraduate and graduate students. DBO consists of a sequence of two courses: Design Build Operate I (DBO I), which focuses on substrate fabrication and Design Build Operate II (DBO II), which focuses on module assembly. This paper presents an overview of the second component of the sequence, the DBO II (module) course. A detailed presentation of the experiments conducted and their results are presented. A user friendly software which helps students to conduct virtual designs and fabrication processes is also presented.

Keywords

educational courses; electronic engineering education; integrated circuit packaging; modules; product development; Design Build Operate course; Georgia Institute of Technology; graduate students; hands-on module packaging education; microelectronic systems packaging; module assembly; product development cycle emulation; system on package; undergraduate students; user friendly software; virtual designs; virtual fabrication processes; Assembly; Automatic testing; Costs; Flip chip; Microelectronics; Partial response channels; Radio frequency; Semiconductor device packaging; Surface-mount technology; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2002. Proceedings. 52nd

ISSN

0569-5503

Print_ISBN

0-7803-7430-4

Type

conf

DOI

10.1109/ECTC.2002.1008308

Filename

1008308