DocumentCode
1699764
Title
Effects of floating heat spreader in high density BGA packages
Author
Varadarajan, Vijay ; Kim, Bruce C. ; Han, Dae-Hyun
Author_Institution
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
fYear
2002
fDate
6/24/1905 12:00:00 AM
Firstpage
1753
Lastpage
1756
Abstract
In this paper we present the effects of heat spreader on a ball grid array (BGA) package. We have simulated a fast switching CMOS inverter inside a BGA package with power, signal and ground planes. We performed simulations to study the effects of the electrical radiation and signal integrity with different configurations of heat spreader.
Keywords
CMOS digital integrated circuits; ball grid arrays; heat radiation; integrated circuit packaging; 0.5 MHz to 3 GHz; CMOS digital chips; ball grid array package; electrical radiation effects; fast switching CMOS inverter; floating heat spreader effects; ground planes; heat spreader configurations; high density BGA packages; power planes; signal integrity; signal planes; simulations; Eddy currents; Electromagnetic interference; Electromagnetic radiation; Frequency; Heat engines; Integrated circuit interconnections; Inverters; Packaging; Resistance heating; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
ISSN
0569-5503
Print_ISBN
0-7803-7430-4
Type
conf
DOI
10.1109/ECTC.2002.1008348
Filename
1008348
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