• DocumentCode
    1700756
  • Title

    System on chip with 1.12mW-32Gb/s AC-coupled 3D memory interface

  • Author

    Canegallo, R. ; Perugini, L. ; Pasini, A. ; Innocenti, M. ; Scandiuzzo, M. ; Guerrieri, R. ; Rolandi, P.L.

  • Author_Institution
    STMicroelectronics, Agrate, Italy
  • fYear
    2009
  • Firstpage
    463
  • Lastpage
    466
  • Abstract
    An AC-coupled 3D memory interface for chip-to-chip communication is implemented in 90 nm CMOS technology. It transfers 128 bit words between stacked SRAMs in an ARM-based System on Chip (SoC) platform at 250 MHz. This interface requires 0.05 mm2 of occupation area and achieves a 32 Gbit/sec of throughput and an average energy consumption of 35 muW/Gbit/sec.
  • Keywords
    CMOS memory circuits; SRAM chips; VHF circuits; system-on-chip; AC-coupled 3D memory interface; ARM-based SoC; CMOS technology; bit rate 32 Gbit/s; chip-to-chip communication; frequency 250 MHz; power 1.12 mW; size 90 nm; stacked SRAM; system-on-chip; word length 128 bit; Aggregates; CMOS technology; Circuits; Clocks; Costs; Energy consumption; Protocols; System-on-a-chip; Throughput; Transmitters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-4071-9
  • Electronic_ISBN
    978-1-4244-4073-3
  • Type

    conf

  • DOI
    10.1109/CICC.2009.5280782
  • Filename
    5280782
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1700756