DocumentCode
1701610
Title
Sensitivity computation using domain-decomposition for boundary element method based capacitance extractors
Author
Bi, Yu ; van der Kolk, K.J. ; Van Der Meijs, N.P.
Author_Institution
EEMCS, Delfa Univ. of Technol., Delft, Netherlands
fYear
2009
Firstpage
423
Lastpage
426
Abstract
The on-going reduction of the on-chip feature size goes together with an increase of process variability. While the manufacturer is expected to improve the uniformity of its output, and the designers are expected to enhance circuit adaptability and reliability, the design tools are expected to deliver convenient and fast approaches capable of giving accurate characterizations of manufacturing tolerances. In this paper, we present an algorithm that enables an extension of 3-D capacitance extractors to generate both the nominal capacitances and their sensitivities w.r.t. all geometric parameters with only one extraction. Using the domain-decomposition technique, it is shown that sensitivities can be derived from the intermediate data of the standard capacitance extraction using the Boundary Element Method (BEM). The algorithm has been implemented in a layout-to-circuit extractor. It is shown by experiments that the additional cost for the sensitivity computation is less than 20% of the standard time consumption, essentially independent of the number of parameters.
Keywords
boundary-elements methods; capacitance; decomposition; integrated circuit interconnections; integrated circuit layout; integrated circuit manufacture; integrated circuit reliability; BEM based 3D capacitance extractor; IC interconnects; boundary element method; circuit adaptability; circuit reliability; domain-decomposition; domain-decomposition technique; layout-to-circuit extractor; manufacturing tolerance characterization; nominal capacitance; on-chip feature size reduction; process variability; sensitivity computation; Boundary element methods; Capacitance; Circuit testing; Delay; Frequency measurement; Inverters; MOS devices; Ring oscillators; Spatial resolution; Tiles;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-4071-9
Electronic_ISBN
978-1-4244-4073-3
Type
conf
DOI
10.1109/CICC.2009.5280813
Filename
5280813
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