• DocumentCode
    1701610
  • Title

    Sensitivity computation using domain-decomposition for boundary element method based capacitance extractors

  • Author

    Bi, Yu ; van der Kolk, K.J. ; Van Der Meijs, N.P.

  • Author_Institution
    EEMCS, Delfa Univ. of Technol., Delft, Netherlands
  • fYear
    2009
  • Firstpage
    423
  • Lastpage
    426
  • Abstract
    The on-going reduction of the on-chip feature size goes together with an increase of process variability. While the manufacturer is expected to improve the uniformity of its output, and the designers are expected to enhance circuit adaptability and reliability, the design tools are expected to deliver convenient and fast approaches capable of giving accurate characterizations of manufacturing tolerances. In this paper, we present an algorithm that enables an extension of 3-D capacitance extractors to generate both the nominal capacitances and their sensitivities w.r.t. all geometric parameters with only one extraction. Using the domain-decomposition technique, it is shown that sensitivities can be derived from the intermediate data of the standard capacitance extraction using the Boundary Element Method (BEM). The algorithm has been implemented in a layout-to-circuit extractor. It is shown by experiments that the additional cost for the sensitivity computation is less than 20% of the standard time consumption, essentially independent of the number of parameters.
  • Keywords
    boundary-elements methods; capacitance; decomposition; integrated circuit interconnections; integrated circuit layout; integrated circuit manufacture; integrated circuit reliability; BEM based 3D capacitance extractor; IC interconnects; boundary element method; circuit adaptability; circuit reliability; domain-decomposition; domain-decomposition technique; layout-to-circuit extractor; manufacturing tolerance characterization; nominal capacitance; on-chip feature size reduction; process variability; sensitivity computation; Boundary element methods; Capacitance; Circuit testing; Delay; Frequency measurement; Inverters; MOS devices; Ring oscillators; Spatial resolution; Tiles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2009. CICC '09. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-4071-9
  • Electronic_ISBN
    978-1-4244-4073-3
  • Type

    conf

  • DOI
    10.1109/CICC.2009.5280813
  • Filename
    5280813